Alloy exceeds J-STD-006C and meets ASTM B 32 purity requirements
Flux meets J-STD-004B
Spreads like rosin-activated flux
Virtually non-splattering
Non-corrosive residue
Non-conductive residue
Halide free
The 4870–4877 of Sn60/Pb40 No Clean Solder Wire is an electronic grade solder wire. It uses a classical tin-to-lead alloy ratio, which is complemented with a no clean, synthetically refined, splatter-proof, resin flux core. The solder wires meet J-STD-004B, ASTM B 32, and J-STD-006C specifications. It melts at a slightly higher temperature and over a wider range than the classical 63/37 solder. It results in robust and reliable joints that are highly resistant to whisker formation.
The leaded solders achieve a consistent solder and flux percentage through a state-of-the-art, extrusion, wire-drawing machine. This machine continually monitors the wire to prevent voids and ensure consistency, providing a top-grade solder wire
Alloy exceeds J-STD-006C and meets ASTM B 32 purity requirements
Flux meets J-STD-004B
Spreads like rosin-activated flux
Virtually non-splattering
Non-corrosive residue
Non-conductive residue
Halide free
The 4870–4877 of Sn60/Pb40 No Clean Solder Wire is an electronic grade solder wire. It uses a classical tin-to-lead alloy ratio, which is complemented with a no clean, synthetically refined, splatter-proof, resin flux core. The solder wires meet J-STD-004B, ASTM B 32, and J-STD-006C specifications. It melts at a slightly higher temperature and over a wider range than the classical 63/37 solder. It results in robust and reliable joints that are highly resistant to whisker formation.
The leaded solders achieve a consistent solder and flux percentage through a state-of-the-art, extrusion, wire-drawing machine. This machine continually monitors the wire to prevent voids and ensure consistency, providing a top-grade solder wire